Identify Solutions to Process / Integration Issues
RocSolid experience across a broad range of areas and device
applications using a systematic method to fix problems
  • Identify the root cause (whether equipment, tool, or integration)
  • Find the best short and long term solution.
Process/Tool
Troubleshooting
  • Metal (Sputter, CVD) and low
    temp oxide deposition (PECVD)
  • Planarization (CMP/REB)
  • Patterning (coat, exposure,
    develop with ARC)
  • Dry and wet etching (Oxide/ Si/
    organic/ metal)
  • Cleans, Surface preparation,
    and Release
  • Through wafer via processing
  • Annealing (Furnace and RTA),
  • Furnace and RTP processing
  • Epi deposition
  • Implant

Mechanical and Electrical
Reliability
  • Mechanical stabillity, stress and
    electromigration failure analysis
  • Life test failure analysis
Technical Consulting
Corporation
Technical Consulting
Corporation
Process Interactions
  • Release and stiction improvement
  • Via and contact formation,
    Corrosion, Cu/Low k damascene,
    interface preparation
  • Trench, active formation, poly, self
    aligned contacts, silicidation,
    planarization

Yield enhancement
  • Defect measurement/
    characterization
  • Wafer handling and contamination
  • Resolution enhancement
    experiments
  • Design Rule creation and CAD
    calibration
  • Statistical Process Control